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涂胶&显影设备 Coater&Developer
Model: MXS3000
+Application • Bump Polyimide and Photo resist coating & Develop, Dry film develop • RDL Dielectrics material coating, Resist Coating & Develop • Other MEMS, R&D Coating & Develop +2300(W)*3000(D)*2200(H), Unit=(mm) +Substrate-Wafer: 8"~12" +FOUP Load-port: 2FOUP +Remote Chemical Supply unit (LCSS/CCSS)
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Technical Data
+General features Substrate size 200 mm and 300 mm round (Option: square and rectangular)
+Substrate handling (Option) Fully automatic FOUP, SMIF, Open cassette
+Substrate processing Fully programmable cluster tool
+User interface Windows 7 operating system with SVS software
# of spin modules Std 4 (Max 8)
# of HP/CP Std 8/2 (Max16/4)
# of recipes 300 with 30 steps (on spin processes) each